Equipment Application
AP50-FS: DAF, HAF, TSA, and PSA placement
AT50-TS: Mounting of PCBs, flex circuits, glass substrates, and 2D/3D components
Equipment Application
AP50-FS: DAF, HAF, TSA, and PSA placement
AT50-TS: Mounting of PCBs, flex circuits, glass substrates, and 2D/3D components
Equipment Functions
Material pick-up & alignment correction, intermediate positioning, simultaneous pick-and-place, material code reading, product code reading, stationary & on-the-fly imaging, thermal-pressure profiling, independent heating vacuum support stage, heated nozzle, laser height measurement, MES data integration, precision self-check, film peeling (optional)
Specifications
Feeding Method
(AP50‑FS): Peel-off feeder (reel/tape)
(AP50‑TS): Tray feeding (automatic tray loading/unloading)
Conveyor Track
(AP50‑FS): Clamping track for placement, <300mm × 140mm
(AP50‑TS): Return track width, <300mm × 140mm
Placement Head
2 sets; head heating <180°C; pressure control 2–50N
Placement Support Stage
2 sets; preheating zone <80°C; placement zone <180°C; pressure monitoring 2–80N
Equipment Precision
±3μm, CmK > 1.33
Placement Accuracy
(AP50‑FS): ±50μm, CPK > 1.33 (High-speed mode)
(AP50‑TS): ±25μm, CPK > 1.33 (High-precision mode)
Placement Efficiency
(AP50‑FS): 0.85 sec/unit (High-speed mode)
(AP50‑TS): 1.2 sec/unit (High-precision mode)
Material Dimensions (mm)
(AP50‑FS): 1–60mm; thickness 0.05–5mm
(AP50‑TS): 1–60mm; thickness 0.05–10mm
Power Supply: AC 220V, 4.7kW
Air Pressure: 0.6MPa
Weight: 1800kg
Dimensions (mm)
L × W × H: 1120 × 1690 × 1510

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