Solution

FPC Series

Dry process

Preparation of Materials

Stock preparation

Apply bonding adhesive

Apply the outer copper layer

Lamination

Apply a protective film

Electrical measurement

AVI Inspection

Material Patching and Placement

Tear away

Nickel strip riveting

Die-cutting

Expansion and contraction measurement

SMT

Cool down

Lower the board

Automatic return line

Top board

Apply auxiliary materials

Lamination

Die-cutting

Punching and shearing

Production Line Integration and Other Solutions

PCB Series

Copper-embedded solutions

Inkjet Printing Solutions

Cutting Solutions

Fusion-based solutions

Unwinding and Rewinding Solutions

Automatic Film-Peeling Machine PF-40

Automatic removal of the backing tape from the underside of the SMT assembly.

Parameters

Automatic removal of the backing tape from the underside of the SMT assembly.

Product Details

Equipment Dimensions (L×W×H): 1100mm × 920mm × 1570mm

Equipment Precision: ±0.02mm

Carrier Size (Max): 400mm × 330mm

Film Peeling Pressure: <10N

Cycle Time: 8s

Film Peeling Success Rate: ≥99.8%

Conveying Method: Belt conveyor

Feeding Method: Inline feed from the previous process or standalone operation

Previous : Developing Mylar Film Stripping Machine Next : Film-Peeling and Tray-Placing Machine ST-PH08

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