Designed for the PCB lamination process, this system utilizes laser heating technology to soften the prepreg (PP) before cutting; this significantly mitigates the dust generation issues associated with traditional cutting methods, while replacing conventional infrared heating with laser heating leads to substantial energy savings.

Parameters

Designed for the PCB lamination process, this system utilizes laser heating technology to soften the prepreg (PP) before cutting; this significantly mitigates the dust generation issues associated with traditional cutting methods, while replacing conventional infrared heating with laser heating leads to substantial energy savings.

Product Details

Machine dimensions: 1600L x 2300W x 2100H mm

Cutting length: 60mm–750mm

Cutting efficiency: ≥18 cuts/min (max. 23 cuts/min)

Cutting thickness: 0.015mm–0.4mm

Edge sealing method: Laser heat sealing

Cutting quality: >98% reduction in edge dust (compared to cold cutting)

Cutting accuracy: ±1mm

Slitting blades: 3 sets

Includes rewinding and edge trim collection functions: 1 set

Collection table: Automatic collection optional

Previous : PP Punching and Cutting Integrated Machine GS-CP8800

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