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FPC Series

Dry process

Preparation of Materials

Stock preparation

Apply bonding adhesive

Apply the outer copper layer

Lamination

Apply a protective film

Electrical measurement

AVI Inspection

Material Patching and Placement

Tear away

Nickel strip riveting

Die-cutting

Expansion and contraction measurement

SMT

Cool down

Lower the board

Automatic return line

Top board

Apply auxiliary materials

Lamination

Die-cutting

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PCB Series

Copper-embedded solutions

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RX-BCC-500A Inspection Machine for Reinforcement Material Misalignment/Adhesive Overflow

Used for visual inspections—such as checking for misalignment or adhesive overflow—after the bonding of reinforcement materials.

Parameters

Used for visual inspections—such as checking for misalignment or adhesive overflow—after the bonding of reinforcement materials.

Product Details

Basic Specifications:

/ Overall Dimensions: L1640 x W900 x H1700 mm

/ Cycle Time (CT): ≤30s/sheet

/ Compatible Product Size: Max. L400 x W300 mm; Min. L150 x W260 mm

/ Power Supply: AC 220V

/ Air Pressure: 0.5–0.7 MPa

/ Equipment Weight: ~500 kg

Previous : RX-BCC-400C Inspection Machine for Missing/Re-applied Material Next : Used for visual inspection after 3D steel sheet lamination.

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