Solution

FPC Series

Dry process

Preparation of Materials

Stock preparation

Apply bonding adhesive

Apply the outer copper layer

Lamination

Apply a protective film

Electrical measurement

AVI Inspection

Material Patching and Placement

Tear away

Nickel strip riveting

Die-cutting

Expansion and contraction measurement

SMT

Cool down

Lower the board

Automatic return line

Top board

Apply auxiliary materials

Lamination

Die-cutting

Punching and shearing

Production Line Integration and Other Solutions

PCB Series

Copper-embedded solutions

Inkjet Printing Solutions

Cutting Solutions

Fusion-based solutions

Unwinding and Rewinding Solutions

Vacuum Press / Rapid Press RTR120

Execute the final bonding process for materials such as CVL, EMI, and PI onto the product following the pre-lamination stage in FPC manufacturing.

Parameters

Execute the final bonding process for materials such as CVL, EMI, and PI onto the product following the pre-lamination stage in FPC manufacturing.

Product Details

Equipment dimensions: 4900 × 1050 × 1900 mm

Material dimensions: 260 mm width

Working area: 700 × 260 mm (L × W)

Working height: 1100 ± 50 mm

Pressing force: 120 tons

Hydraulic pressure: 20–140 kgf/cm²

Operating temperature: 180°C ± 5°C

Max. material feed length: 750 mm

Operation mode: Continuous processing of single-lane 260 mm coil stock

Control system: PLC + HMI

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